In the era of 5G Internet of Things, various types of reflow soldering processes are analyzed to ens
Source:Viona Lee Release time:2023-07-20 359 Second view

With the continuous development of SMT electronic components towards miniaturization, chip integration is becoming increasingly high. Whether it is laptops, smartphones, medical devices, automotive electronics, military and aerospace products, the array packaging of BGA, CSP and other devices in products is increasingly applied, and the quality requirements for products are also increasing. 5G was a popular term in 2019, and now the 5G era has begun. From the perspective of the PCBA circuit board of mobile phones, compared to 4G phones, the design difficulties of 5G phones are mainly focused on RF, antennas, and other aspects besides baseband chips. Due to the fact that 5G has at least one time higher frequency, five times wider frequency band, up to 29 frequency bands, five times higher power, ten times higher speed, and dozens of times more antennas than 4G.


This requires us to continuously improve our process capabilities, add high-end equipment, and ensure high reliability products through high-quality welding. There are many SMT production equipment in high-precision electronic manufacturing processes for the analysis of various processes of PCBA high reliability welding. The main automation equipment includes SMT automatic X-RAY point machine, SMT first article detector, fully automatic solder paste printing machine, online 3D-SPI solder paste printing detector, SMT mounting machine, reflow soldering, online AOI optical detector, online PCBA fully automatic milling cutter and plate splitting machine, etc. Each device has a specific function and purpose, and the reflow soldering furnace is the final process of the SMT production line, responsible for melting the solder of PCB circuit boards and components that have already been installed and bonding them to the motherboard.


Reflow soldering has become the mainstream process of SMT, and most of the components on our commonly used smartphone boards are welded to the circuit board through this process. It relies on the action of hot airflow on the solder joints, and the adhesive flux undergoes physical reactions under a certain high-temperature airflow to achieve SMD welding; The reason why it is called "reflow welding" is because the gas circulates in the welding machine to generate high temperature and achieve the welding purpose; There are also many types of reflow soldering furnaces, such as hot air reflow soldering, nitrogen reflow soldering, gas phase reflow soldering, vacuum reflow soldering, etc.




 


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